主持人：何晓宁

Moderator：He Xiaoning

陕西省半导体行业协会常务副理事长兼秘书长

Executive Vice Chairman and Secretary General of Shaanxi Semiconductor Industry Association

刘国友 中车科学家 功率半导体与集成技术全国重点实验室副主任、西南交通大学集成电路学院副院长

Guoyou Liu，CRRC scientist、Deputy Director, National Key Lab of Power Semiconductor and Integration, CRRC; Associate Dean, School of Integrated Circuits, Southwest Jiaotong University

功率半导体融合与集成技术

Power Semiconductor Integration and Convergence Technology

李仕群 北方华创微电子装备有限公司化合物半导体行业总裁

Shiqun Li，President of the Compound Semiconductor Industry Division，Beijing NAURA Microelectronics Equipment Co.,Ltd.   

同芯共赢，以装备创新推动第三代半导体产业蓬勃发展

Promoting the Thriving Development of the Third-generation Semiconductor Industry through Equipment Innovation 

陈立烽 英飞凌科技（中国）有限公司高级技术总监

Albert Chen, Senior Director of Infineon Technologies China Co.,Ltd. 

CoolSiC™ MOSFET 赋能电力电子系统的创新设计

CoolSiC™ MOSFET enables innovative design for power electronics system 

马荣耀 华润微电子（重庆）有限公司产品线总经理

MA RONG YAO, General manager, China Resources(chongqing )Microelectronics Limited

SiC MOS技术进步驱动行业变革

SiC MOS technology advancements drive industry transformation

周晓阳 广东芯聚能半导体有限公司总裁

Gilbert Zhou，President，AccoPower Semiconductor Co.,Ltd.

国产碳化硅芯片正在进入新能源汽车主驱逆变器市场

Local SiC chips entering new energy vehicle market

丁国华 苏州锴威特半导体股份有限公司董事长

Ding Guohua，President，Suzhou Convert Semiconductor Co., Ltd

从“贵族”走向“亲民”——SiC MOSFET的技术迭代及应用机遇

From Elite to Mainstream

—SiC MOSFET: Tech Evolution & New Opportunities

张涛 华羿微电子股份有限公司高级封装技术专家

Zhang Tao，Advanced packaging technology expert，HUAYI MICROELECTRONICS CO.,LTD 

从“性能优势” 到“落地可靠”：第三代半导体封装技术的挑战与未来

From 'Performance Advantage' to 'Reliable Implementation': Challenges and Future of Third Generation Semiconductor Packaging Technology

张清纯 复旦大学特聘教授

QINGCHUN ZHANG，Distinguished Professor，Fudan University

百安及千-万伏氧化镓功率器件研究进展

Hundred A and kV-10 kV Ga2O3 Power Devices Progresses

唐军 中电化合物半导体有限公司副总经理

Tangjun，vice general manager，CEC compound Semiconductor Co.,Ltd. 

用于功率射频器件的氮化镓外延材料发展趋势

Development Trends of GaN Epitaxial Materials for Power RF Devices 

陈祥龙 青岛思锐智能科技股份有限公司副总经理

Chen Xianglong,Deputy General Manager,Qingdao SRI Intellectual Technology Co.,Ltd

功率与化合物半导体制造双引擎：原子层沉积和离子注入的创新实践

Dual Engines for Power and Compound Semiconductor Manufacturing: Innovations in Atomic Layer Deposition and Ion Implantation

黄伟 江南大学教授

Huang wei, Professor, Jiang Nan University

GaN HEMTs/NPN异质集成与辐照研究

heterogeneous integration of GaN HEMTs/NPN and its Radiated Mechanisms

庞亚楠 上海芯导电子科技股份有限公司第三代产品线负责人

YANAN.PANG，Wide Bandgap Power Semicond，SHANGHAI PRISEMI ELECTRONICS CO.,LTD 

氮化镓功率器件技术发展与应用

Advances and Applications of GaN Power Devices

姜南 无锡能芯检测科技有限公司总经理

Nan Jiang,CEO, Wuxi Powersemilab Co.Ltd 

SiC功率器件动态可靠性测试方法

Dynamic reliability Tests for SiC power devices

马志勇 北京芯创智源知识产权咨询服务有限公司研究员

Ma Zhiyong, Professor, Beijing Xinchuang Zhiyuan Intellectual Property Consulting Service Co.,Ltd

中国半导体设备"创新+合规"双螺旋发展路径

The Dual Helix of Innovation and Compliance for China's Semiconductor Equipment Industry