高峰论坛
| 日期： | 2022年10月28日（周五） |
| 时间： | 08:45-18:10 |
| 地点： |
无锡太湖国际博览中心B1馆 |
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主持人：金存忠 中国电子专用设备工业协会常务副秘书长 Host:Cunzhong JIN, Executive Deputy Secretary general of China Electronic Production Equipment Industry Association
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08:45-9:15 |
致欢迎辞 中国电子专用设备工业协会领导 Leader from China Electronic Production Equipment Industry Association 无锡市政府领导 Leader from Wuxi Municipal Government 江苏省政府领导 Leader from Jiangsu Provincial Government
领导讲话 科技部领导 Leader from Ministry of Science and Technology 02专项技术总师 Leader from National Science and Technology Major Projects(02)
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09:15-09:30
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不忘初芯 聚焦硬核 Don't forget the initial mind and focus on the hard core 崔荣国 无锡国家高新区管理委员会书记、无锡市新吴区党工委书记 Rongguo Cui, Party Secretary, Wuxi National High tech Industrial Development Zone Management Committee
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09:30-09:50 |
茶歇与展览交流 Networking Break |
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09:50-10:10
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智能时代背景下的仪器设备技术 Instrumentation and equipment technology in the intelligent era |
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储君浩 中国科学院院士 Junhao Chu, Academician of the Chinese Academy of Sciences
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10:10-10:30
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半导体制程工艺与装备发展的回顾与展望 Review and Prospect of Semiconductor Process Technology & Equipment Development |
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王序进 院士 深圳大学微电子研究院&半导体制造研究院院长 Xujin WANG , Institute of Microelectronics & Institute of Semiconductor Manufacturing Research Shenzhen University
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10:30-10:50
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国内半导体产能的快速提升将面临设备供给的挑战 Fast Booming of Internal Semi Capacity Facing Equipment Supply Challenges |
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陈浩 上海陛通半导体能源科技有限公司市场销售副总裁 Jerry Chen, Vice President of Marketing &Sales of BETONE TECHNOLOGY SHANGHAI,INC
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10:50-11:10
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从“造”到“用”国产设备材料未来可期 From manufacture to use, domestic equipment and materials are expected in the future |
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李虹 博士 华润微电子有限公司总裁 Dr. Hong Li, CEO of China Resources Microelectronics Limited Company |
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11:10-11:30
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原子级工程：原子层沉积技术的展望 Atomic Scale Processing: An Outlook of ALD Technology |
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黎微明 江苏微导纳米科技股份有限公司副董事长兼首席技术官 Li Weimin, Vice-chairman & CTO of Jiangsu LeadmicroNano-Technology Co. ,Ltd.
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11:30-11:50
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国产半导体设备进程 Domestic Semiconductor Equipment Process |
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陈俊宇 博士 复旦大学积塔集成电路联合实验室副主任，研究员 Dr. Chen Junyu, Deputy Director and Researcher of Jita Integrated Circuit Joint Laboratory of Fudan University
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11:50-12:10
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半导体设备产业发展的机遇与挑战 Opportunities and Challenges for the Development of Semiconductor Equipment Industry |
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陈福平 盛美半导体设备（上海）股份有限公司副总经理 Fuping Chen, vice president of ACM Research(Shanghai),lnc
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12:10-13:10 |
自助午餐Buffet Lunch |
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主持人：李晋湘 中国电子专用设备工业协会副秘书长 华大半导体有限公司总工程师 Host: Jinxiang Li, Executive Deputy Secretary general of China Electronic Production Equipment Industry Association，Chief Engineer of HUADA SEMICONDUCTOR CO.,LTD.
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13:10-13:30
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汽车芯片生产线的配置需求 Configuration Requirements of Automobile Chip Production Line |
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李晋湘 华大半导体有限公司总工程师、积塔半导体公司公司董事 Jinxiang Li, Chief Engineer of HUADA SEMICONDUCTOR CO.,LTD.
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13:30-13:50
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设计制造一体化良率解决方案后摩尔时代的创新机遇 Design and manufacture integrated yield solutions,the Opportunities for innovation in the post-Moore era |
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俞宗强 博士 东方晶源微电子科技（北京）有限公司董事长兼首席技术官 Zongchang Yu, Chairman/CTO of DongfangJingyuan Electron Limited
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13:50-14:10
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锐意进取满帆前行的国产大硅片 Domestic Large Size Silicon Wafer -- Forging Ahead |
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李炜 博士 上海硅产业集团股份有限公司执行副总裁兼董事会秘书 Dr Li Wei, EVP/Board Secretary of NSIG
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14:10-14:30
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汇专半导体行业加工整体解决方案 Conprofe's Machining Solutions for Semiconductor Industry |
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颜炳姜 汇专科技集团股份有限公司董事长 Johnson Yan, Chairman of Conprofe Technology Group Co.,Ltd
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14:30-14:50
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国产薄膜设备的机遇和挑战 Opportunities and challenges for Domestic Thin Film Equipment |
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宁建平 拓荆科技股份有限公司 高级总监 Jianping Ning, Senior Director of Piotech, Inc.
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14:50-15:10
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自主核心技术的纳米精度半导体超精密定位平台及超精密数控机床 Nano-precision semiconductor ultra-precision positioning stage and ultra-precision machine tool |
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伍鹏 博士 华领精机(浙江)有限公司董事长 Dr. WU PENG Chairman of HuaLing Precision Machinery (ZheJiang) Co., Ltd.
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15:10-15:30
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集成电路CMP装备国产化进展 Localization of Integrated Circuit CMP Equipment |
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王同庆 华海清科股份有限公司副总经理 Tongqing Wang, Deputy General Manager of Hwatsing Technology CO., LTD.
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15:30-15:50 |
茶歇与展览交流 Networking Break |
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15:50-16:10
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后摩尔时代之键合技术发展与应用 Development and Application of Bonding Technology in Post-Moore's Law |
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周谦光 苏州芯睿科技有限公司 董事长特别助理 Joseph Chou,Special Assistant of Chairman of Suzhou WiseeTec Co.,Ltd
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16:10-16:30
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原子层沉积工艺和设备开创超摩时代新维度 Atomic Layer Deposition process and equipment set to transform the More-than Moore era up to 300 mm |
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聂翔 青岛四方思锐智能技术有限公司总经理 Xiang Nie, General Manager of Qingdao Sifang SRI Intellectual Technology Co. Ltd
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16:30-16:50
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荷兰NTS集团简介 –半导体设备中的高精密运动模组 Introduction of NTS group-High precision motion module for Semiconductor equipment |
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靳路山 荷兰NTS集团 - 莱腾仕精密机电上海有限公司中国区业务开发经理 John Jin, China Business development manager of Netherland NTS group- NTS Mechatronics Shanghai Co.,Ltd.
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16:50-17:10
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苏科思UPSS高端半导体精密运动系列产品解决方案 Sioux UPSS motion control olutions for High-end Semiconductor Equipment |
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曾旭 博士 亚太区半导体事业部副总裁/江苏集萃苏科思科技有限公司 Xu Zeng, Ph.D. Vice President of Asia Semiconductor Business Unit Sioux China Jiangsu JITRI Sioux Technologies Co., Ltd.
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17:10-17:30 |
新一代半导体前道量测设备赋能Fab竞争力 Next Generation WFE Metrology Tools Empowering Fab Competitive Advantage |
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洪峰 深圳市埃芯半导体科技有限公司 R&D VP Feng Hong , R&D VP of Shenzhen Angstrom Excellence Technology Co., Ltd |
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